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Review FachPack 2010: A complete success – progress through sustained packaging solutions

This year’s FachPack closed its doors at the Nuremberg Trade Fair Centre on 30th September 2010 having attracted 35,360 visitors from around the world and thus records improvements in all important respects at the start of its fourth decade. The good mood and creative atmosphere at FachPack 2010 was also apparent from the response and positive mood at SONOTRONIC’s stand.

Review FachPack 2010: A complete success – progress through sustained packaging solutions

SONOTRONIC at FackPack 2010 tarde fair

FachPack 2010 FachPack 2010Under the catch words, GREEN SONICS, SONOTRONIC, as the leading innovator in matters of sustainability and energy efficiency, presented proven ultrasonic solutions, concepts and components in the welding and sealing of packaging. This aroused particularly keen interest amongst the trade fair visitors because GREEN SONICS technology is ecologically and economically significant in packaging technology:  in addition to lower energy consumption compared with processes that use heat (1/4 of the electrical energy requirement = 75 % less CO2 pollution) and less packaging material, GREEN SONICS supports the DMAIC Six-Sigma core process with significantly less defective production.

A further highlight at our stand was the solution developed by partner and co-exhibitor, Widmann, using ultrasonic tools from SONOTRONIC for the ultrasonic welding of Spaut closures. The procedure is considered a pioneering achievement, because up to now the problem was regarded as unsolved. For the first time, ultrasound enables high-quality Spaut closures to be welded in series.

As an applications partner in packaging technology, SONOTRONIC has already been involved in several ground-breaking innovations. Another example is the ultrasonic sealing system for tubular bags, which was also exhibited at Fachpack in the SmartPaker SX400 from CFS and aroused considerable visitor interest.

The fact that the ultrasonic technology of SONOTRONIC has become established in the packaging market was again made clear at FachPack 2010. To summarise, FachPack was also a complete success in every respect in 2010. We look forward to welcoming you again in 2011, at interpack in Düsseldorf.

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