Review of the interpack '08: Great interest in innovative ultrasonic technologies
Under the slogan “Ultrasonic Packaging” we presented innovative ultrasonic technologies for the packaging industry at this year’s interpack. In addition to informative talks, the international trade audience expected practical demonstrations of various applications at our stand.
Technical discussions on the subject of ultrasonic in the packaging industry
Using golf ball packaging as an example, we joined forces with our partner, Widmann, to demonstrate stamping, cutting and welding using ultrasonic technologies. Printed packaging film was cut to size or stamped in the Widmann machine using SONOTRONIC ultrasonic units. After folding the blank produced, the packaging was welded, by way of an example, on one of our standard machines. The large number of visitors was particularly interested in the possibilities offered by ultrasound for machining thermoplastics and films in the packaging industry.
SONOTRONIC also highlighted at interpack an ultrasonic film indexing machine for cross-welding film webs. Using its innovative technology, it achieves cycle times of up to 900 cycles / min. The visitors were also impressed by the great stability of the machine, which was achieved by a special reciprocating movement of the sonotrode and by rotating the anvil.
Apart from the ultrasonic
packaging solutions, the visitors to our stand were able to visualise how the
highly developed ultrasonic technology can be used to cut food. To demonstrate
this, our marzipan-short pastry logo biscuits were accurately cut into pieces
by a Teflon® coated sonotrode. While the biscuits were enjoyed,
information was exchanged and technical discussions about potential
applications and areas of use of ultrasound finally came to the fore.
As your machine and component manufacturer, know-how and engineering service provider, we look forward to welcoming you at the next interpack, where we will be pleased to advise you again on matters concerning “Ultrasonic Packaging”.